Chip Attach/Ball Attach Packaging Module Development Engineer

Intel

  • Kulim, Kedah
  • Tetap
  • Sepenuh masa
  • 24 hari lepas
Job Details:Job Description:Packaging Module Development Engineer within Chip Attach Module/SLI Assembly Module (CAM/SLAM) in Assembly Test Technology Development (ATTD) as part of ATTD in Asia initiative.CAM/SLAM Process covers: Chip Attach, Component Attach and Solder Ball Attach
  • Candidate will focus on Process & Technology Development for New Product (NPI), Shuttle Program, Test Vehicle & IFS Product.
  • Technical knowledge in Research & Development (R&D), Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization
  • Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
  • Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
  • Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
  • Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.
  • Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.
Qualifications:
  • BEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical); MSc & PhD is preferable.
  • Min. 5 years in semiconductor assembly equipment and process; 8 Years experience and above are preferred.
  • Excellent influencing, written and verbal communication skills.
  • Strong data analysis capabilities and problem-solving skills.
  • Proactive and positive approach towards challenges. Able to work under tight timelines and perform under pressure.
Job Type: Experienced HireShift: Shift 1 (Malaysia)Primary Location: Malaysia, KulimAdditional Locations:Business group:Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of Trust N/AWork Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Intel