Be the driver of Package Technology DFMEA. Job Description In your new role you will: Be the owner of Risk Interaction assessment and mitigation work packages. Integration of unit processes (BOM and Process) in package platform -Risk assessment, study interaction with other processes, process flow. Be the working partner for FE in FE/BE interaction and integration topics. Support Pre development for new Chip technology. Driver/team member for 8D/problem-solving for interaction issues. Provide technical guidance/assistance when needed in the projects related to interaction topic. Your Profile You are best equipped for this task if you have: Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics). Prefer 5 years of working experience in the IC/semiconductor environment. Semiconductor Packaging, Assembly and Test knowledge. Good attitude for communication, collaboration, negotiation and solution-finding. Experience in 8D & T6s methodology. Internal Package analysis/first-level reliability. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Show more Show less