Implement technical risk assessment and NUDD (New, Unique, Different, Difficult) analysis when new designs and/or design rules are introduced, and lead execution of risk mitigation. Develop holistic qualification plans and coordinate execution. Provide recommendations on release of new package technologies based on test results and technical risk assessment. Provide SME input to problem solving for Module/SSD technology related issues to ensure effective root cause analysis and corrective/preventive actions. Work with customer-facing teams to draft and present content to address customer issues and requests. Bachelor's degree or equivalent experience Engineering & Science -Electrical & electronics, mechanical, material science and engineering, physics, or related field of study 5+ years' experiences in PCBA (Printed Circuit Board Assembly) design, manufacturing, or quality/reliability. Experience with board-level reliability test methods, reliability acceleration modeling, and sampling statistics! Understanding of thermal, thermo-mechanical, and corrosion-related failure mechanisms for PCBAs! Knowledge of PCBA manufacturing processes. Understanding of mechanical and material interaction effects on reliability of IC components and PCBAs. Understanding of statistics and quality management (SPC, FMEA, 8D CAR, etc.) Must be self-motivated, able to work independently, and detail oriented. Strong analytical problem-solving skills, excellent multi-tasking skills, and the ability to interact easily with other groups. Good written and verbal communication skills in English
